Features
● Low profile package
● Ideal for automated placement
● Glass passivated chip junctions
● Ultrafast reverse recovery time
● Low switching losses, high efficiency
● High forward surge capability
● High temperature soldering：
   260℃/10 seconds at terminals
● Component in accordance to
   RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date
● Case: JEDEC DO-214AA molded plastic
   body over glass passivated chip
● Terminals: Solder plated, solderable per
   JESD22-B102
● Polarity: Laser band denotes cathode end