128Kx32 SRAM MODULE, SMD 5962-93187
FEATURES
■ Access Times of 70, 85, 100, 120ns
■ MIL-STD-883 Compliant Devices Available
■ Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic
HIP (Package 400).
• 68 lead, 40mm Low Profile CQFP, 3.56mm (0.140")
(Package 502).
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch)
square, 4.57mm (0.140 inch) high, (Package 510)
■ Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8
■ Commercial, Industrial and Military Temperature Ranges
■ 5V Power Supply
■ Low Power CMOS
■ TTL Compatible Inputs and Outputs
■ Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
■ Weight
• WS128K32-XG2UX - 8 grams typical
• WS128K32-XH1X - 13 grams typical
• WS128K32-XG4TX - 20 grams typical
■ Upgradeable to 512Kx32