BIT3713 查看數據表（PDF） - Unspecified
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BIT3713 Datasheet PDF : 11 Pages
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Beyond Innovation Technology Co., Ltd.
Order Information:
BIT3713
SO: SOP SS: SSOP
Part number
Beyond Innovation Technology Co., Ltd.
Soldering Information
Reflow Soldering:
The choice of heating method may be influenced by plastic QFP package). If infrared or vapor phase heating is
used and the package is not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small
amount of moisture in them can cause cracking of the plastic body. Preheating is necessary to dry the paste and
evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to
the printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface
temperature of the packages should preferable be kept below 245 °C for thick/large packages (packages with a thickness
2.5 mm or with a volume 350 mm3 so called thick/large packages). The top-surface temperature of the
packages should preferable be kept below 260 °C for thin/small packages (packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called thin/small packages).
Stage
1st Ram Up Rate
Preheat
2nd Ram Up
Solder Joint
Peak Temp
Ram Down rate
Condition
max3.0+/-2 /sec
150 ~200
max3.0+/-2 /sec
217 above
260 +0/-5
6 /sec max
Duration
-
60~180 sec
-
60~150 sec
20~40 sec
-
Temp ( )
260
217
200
150
25
RT
‘05/12/15
Preliminary
60~ 180
60~150
Confidential, for authorized user only
BiTEK
December 20, 2005
DCC CONTROLLED
Time(sec)
page 9 of 11
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