MAX9268 查看數據表（PDF） - Maxim Integrated
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MAX9268 Datasheet PDF : 35 Pages
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Gigabit Multimedia Serial Link Deserializer
with LVDS System Interface
ABSOLUTE MAXIMUM RATINGS
AVDD to AGND.....................................................-0.5V to +3.9V
DVDD, IOVDD to AGND.......................................-0.5V to +3.9V
GND to AGND.......................................................-0.5V to +0.5V
IN+, IN- to AGND..................................................-0.5V to +1.9V
TXOUT__, TXCLKOUT_ to AGND.........................-0.5V to +3.9V
All Other Pins to GND.......................... -0.5V to (VIOVDD + 0.5V)
TXOUT__, TXCLKOUT_ Short Circuit to Ground
or Supply................................................................Continuous
Continuous Power Dissipation (TA = +70°C)
48-Pin TQFP (derate 36.2mW/°C above +70°C)....2898.6mW
Human Body Model (RD = 1.5kΩ, CS = 100pF)
(IN+, IN-) to AGND..........................................................±8kV
(TXOUT__, TXCLKOUT_) to AGND..................................±8kV
All Other Pins to GND...................................................±3.5kV
IEC 61000-4-2 (RD = 330Ω, CS = 150pF)
Contact Discharge
(IN+, IN-) to AGND...................................................±10kV
(TXOUT__, TXCLKOUT_) to AGND............................±8kV
Air Discharge
(IN+, IN-) to AGND........................................................±12kV
(TXOUT__, TXCLKOUT_) to AGND................................±20kV
ISO 10605 (RD = 2kΩ, CS = 330pF)
Contact Discharge
(IN+, IN-) to AGND..........................................................±8kV
(TXOUT__, TXCLKOUT_) to AGND..................................±8kV
Air Discharge
(IN+, IN-) to AGND........................................................±15kV
(TXOUT__, TXCLKOUT_) to AGND................................±30kV
Operating Temperature Range......................... -40°C to +105°C
Junction Temperature......................................................+150°C
Storage Temperature Range............................ -65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Soldering Temperature (reflow).......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
48 TQFP
Junction-to-Ambient Thermal Resistance (BJA).......27.6°C/W
Junction-to-Case Thermal Resistance (BJC).................2°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VAVDD = VDVDD = 3.0V to 3.6V, VIOVDD = 1.7V to 3.6V, RL = 100Ω Q1% (differential), TA = -40NC to +105NC, unless otherwise noted.
Typical values are at VAVDD = VDVDD = VIOVDD = 3.3V, TA = +25NC.)
PARAMETER
SYMBOL
CONDITIONS
SINGLE-ENDED INPUTS (BWS, INT, CDS, EQS, MS, PWDN, SSEN, DRS)
High-Level Input Voltage
VIH1
MIN TYP MAX UNITS
0.65 x
VIOVDD
V
Low-Level Input Voltage
VIL1
Input Current
IIN1
VIN = 0V to VIOVDD
Input Clamp Voltage
VCL
ICL = -18mA
SINGLE-ENDED OUTPUTS (WS, SCK, SD/CNTL0, CNTL1, CNTL2/MCLK)
0.35 x
VIOVDD
V
-10
+10
FA
-1.5
V
DCS = 0
VIOVDD
- 0.3
High-Level Output Voltage
VOH1 IOUT = -2mA
V
DCS = 1
VIOVDD
- 0.2
Low-Level Output Voltage
Output Short-Circuit Current
VOL1
IOUT = 2mA
DCS = 0
DCS = 1
0.3
V
0.2
VOUT = VGND,
VIOVDD = 3.0V to 3.6V 15
25
39
DCS = 0
IOS
VOUT = VGND,
VIOVDD = 1.7V to 1.9V 3
VIOVDD = 3.0V to 3.6V 20
7
35
13
63
mA
DCS = 1
VIOVDD = 1.7V to 1.9V 5
10
21
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