HS-303CEH 查看數據表（PDF） - Intersil
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HS-303CEH Datasheet PDF : 10 Pages
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HS-303CEH
Layout Characteristics
Step and Repeat: 2815µm x 5325µm
PAD NAME
TABLE 2. LAYOUT X-Y COORDINATES
X (µm)
Y (µm)
DX (µm)
DY (µm)
S3
0
4672.5
109
109
D3
-4.5
3861
109
109
D1
-4.5
1314
109
109
S1
0
617.5
109
109
IN1
0
0
109
109
GND
878
0
109
109
VEE
1246
0
109
109
IN2
2124
0
109
109
S2
2124
617.5
109
109
D2
2128.5
1314
109
109
D4
2128.5
3861
109
109
S4
2124
4672
109
109
VCC
1062
4675
109
109
NOTE: "Origin" as labeled in the Metallization Mask layout is the centroid
of the pad labeled "IN1".
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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8
FN8399.1
April 19, 2013
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