NLX2G66MU3TCG(2016) 查看數據表（PDF） - ON Semiconductor

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NLX2G66MU3TCG
(Rev.:2016)

Dual Bilateral Analog Switch / Digital Multiplexer

ON Semiconductor 

NLX2G66

PACKAGE DIMENSIONS

UDFN8 1.45x1.0, 0.35P

CASE 517BZ

ISSUE O

D

AB

PIN ONE

REFERENCE

2X

0.10 C

ÉÉÉÉÉÉ

2X

0.10 C TOP VIEW

0.05 C

0.05 C

SIDE VIEW

E

A3

A

A1

C

SEATING

PLANE

e/2

1

L1

e

4

7X L

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55

A1 0.00 0.05

A3 0.13 REF

b 0.15 0.25

D 1.45 BSC

E 1.00 BSC

e

0.35 BSC

L 0.25 0.35

L1 0.30 0.40

RECOMMENDED

SOLDERING FOOTPRINT*

7X

0.48

8X

0.22

1.18

8

5

BOTTOM VIEW

8X b

0.10 M C A B

0.05 M C NOTE 3

1

0.53

PKG

OUTLINE

0.35

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

9

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