UPD98401AGD-MML 查看數據表（PDF） - NEC => Renesas Technology

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UPD98401AGD-MML

ATM SAR CHIP

NEC => Renesas Technology 

CONTENTS

µPD98401A

1. PIN FUNCTION ..................................................................................................................................... 7

1.1 PHY Device Interface Pin ............................................................................................................. 7

1.2 Bus Interface Pins ........................................................................................................................ 9

1.3 Bus Monitor Pins ........................................................................................................................ 12

1.4 Control Memory Interface Pins.................................................................................................. 13

1.5 JTAG Boundary Scan Pins ........................................................................................................ 14

1.6 Test Pin........................................................................................................................................ 14

1.7 Power Supply and Ground Pins................................................................................................ 14

1.8 Pin Status During and After Reset ............................................................................................ 15

2. DIFFERENCES FROM µPD98401.................................................................................................... 16

2.1 Additional Functions.................................................................................................................. 16

2.2 Differences from µPD98401 (NEASCOT-S10TM)........................................................................ 16

3. ELECTRICAL SPECIFICATIONS ...................................................................................................... 17

4. PACKAGE DRAWINGS ...................................................................................................................... 33

5. RECOMMENDED SOLDERING CONDITIONS.................................................................................. 34

6

Data Sheet S12100EJ3V0DS00

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