TGA1342-EPU(2001) 查看數據表（PDF） - TriQuint Semiconductor
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TGA1342-EPU Datasheet PDF : 8 Pages
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Advance Product Information
TGA1342-EPU
Chip Assembly and Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
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rev 11/10/98
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