0.686
RF IN
0.000
Dimensions in mm
RF I/O Pad: 200x100 mm
DC Pads: 105x105 mm
Die Area: 3.909 mm2
Advance Product Information
Feb 4, 2000
TGA1135B
1.480
0.833
PWR DET
(175x100µm)
0.373
RF OUT
0.098
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
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