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CP285 数据手册 ( 数据表 ) - Central Semiconductor

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零件编号
CP285

产品描述 (功能)
Power Transistor NPN - Silicon Power Transistor Chip

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1 Pages

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33.5 kB

生产厂家
Central-Semiconductor
Central Semiconductor Central-Semiconductor

PROCESS DETAILS

   Die Size 105 x 105 MILS
   Die Thickness 9.5 MILS
   Base Bonding Pad Area 32 x 22 MILS
   Emitter Bonding Pad Area 33 x 24 MILS
   Top Side Metalization Al - 45,000Å
   Back Side Metalization Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å)


零件编号
产品描述 (功能)
PDF
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