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CP287 数据手册 ( 数据表 ) - Central Semiconductor

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零件编号
CP287

产品描述 (功能)
Power Transistor 8.0 Amp NPN Silicon Power Transistor Chip

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生产厂家
Central-Semiconductor
Central Semiconductor Central-Semiconductor

PROCESS DETAILS

   Die Size 130 x 130 MILS
   Die Thickness 9.5 MILS
   Base Bonding Pad Area 37 x 20 MILS
   Emitter Bonding Pad Area 38 x 20 MILS
   Top Side Metalization Al - 45,000Å
   Back Side Metalization Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å)


零件编号
产品描述 (功能)
PDF
生产厂家
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Power Transistors 8.0 Amp NPN - High Voltage Transistor Chip
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Power Transistor NPN - Silicon Power Transistor Chip ( Rev : 2003 )
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Power Transistor NPN - Silicon Power Transistor Chip
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