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RMPA2263 数据手册 ( 数据表 ) - Fairchild Semiconductor

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零件编号
RMPA2263

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7 Pages

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111.5 kB

生产厂家
Fairchild
Fairchild Semiconductor Fairchild

General Description
The RMPA2263 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the call for ultra-low DC power consumption and extended battery life in portable electronics, the RMPA2263 uses novel proprietary circuitry to dramatically reduce amplifier current at low to medium RF output power levels (< +16 dBm), where the handset most often operates. A simple two-state Vmode control is all that is needed to reduce operating current by more than 50% at 16 dBm output power, and quiescent current (Iccq) by as much as 70% compared to traditional power-saving methods. No additional circuitry, such as DC-to-DC converters, are required to achieve this remarkable improvement in amplifier efficiency.


FEATUREs
■ 40% WCDMA efficiency at +28 dBm Pout
■ 14% WCDMA efficiency (85 mA total current) at +16 dBm Pout
■ Linear operation in low-power mode up to +19 dBm
■ Low quiescent current (Iccq): 25 mA in low-power mode
■ Meets UMTS/WCDMA performance requirements
■ Meets HSDPA performance requirements
■ Single positive-supply operation with low power and shutdown modes
    – 3.4V typical Vcc operation
    – Low Vref (2.85V) compatible with advanced handset chipsets
■ Compact Lead-free compliant LCC package – (4.0 x 4.0 x 1.5 mm nominal)
■ Industry standard pinout
■ Internally matched to 50 Ohms and DC blocked RF input/output

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产品描述 (功能)
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