LIS3L02DQ 查看數據表（PDF） - STMicroelectronics
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LIS3L02DQ Datasheet PDF : 19 Pages
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LIS3L02DQ
3 FUNCTIONALITY
3.1 Sensing element
The THELMA process is utilized to create a surface micro-machined accelerometer. The technology al-
lows to carry out suspended silicon structures which are attached to the substrate in a few points called
anchors and free to move on a plane parallel to the substrate itself. To be compatible with the traditional
packaging techniques a cap is placed on top of the sensing element to avoid blocking the moving parts
during the molding phase.
The equivalent circuit for the sensing element is shown in the below figure; when a linear acceleration is
applied, the proof mass displaces from its nominal position, causing an imbalance in the capacitive half-
bridge. This imbalance is measured using charge integration in response to a voltage pulse applied to the
sense capacitor.
The nominal value of the capacitors, at steady state, is few pF and when an acceleration is applied the
maximum variation of the capacitive load is few tenth of pF.
Figure 4. Equivalent electrical circuit
Cps1
Rs1
S1x
Cs1x
Cpr
Rr
Cps2
Cps1
Cs2x
Rs2
Rs1
S2x
S1y
Cs1y
Cpr
Rr
rot
Cs2y
Cps2
S2y
Rs2
Cps1
Cpr
Rs1
Cs1z
Rr
S1z
Cs2z
Cps2
S2z
Rs2
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