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2SK4075B-ZK-E1-AY 查看數據表(PDF) - Renesas Electronics

零件编号
产品描述 (功能)
比赛名单
2SK4075B-ZK-E1-AY
Renesas
Renesas Electronics Renesas
2SK4075B-ZK-E1-AY Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
TAPE INFORMATION
There are two types (-E1, -E2) of taping depending on the direction of the device.
Draw-out side
2SK4075B
Reel side
MARKING INFORMATION
K4075B
Abbreviation of part number
Pb-free plating marking
Lot code
RECOMMENDED SOLDERING CONDITIONS
The 2SK4075B should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Infrared reflow
Partial heating
Soldering Conditions
Maximum temperature (Package's surface temperature): 260°C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220°C: 60 seconds or less
Preheating time at 160 to 180°C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Maximum temperature (Pin temperature): 350°C or below
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Recommended
Condition Symbol
IR60-00-3
P350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet D20258EJ1V0DS
7

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